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8 Layer HDI Blind Buried Half Hole PCB 1.0 MM Thickness

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Witgain Technology Limited

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Name: 8 Layer HDI Blind Buried Half Hole PCB 10 MM Thickness
Brand: WITGAIN PCB
Price: 1 USD

Brand Name : WITGAIN PCB

Model Number : Half hole PCB0017

Certification : UL

Place of Origin : China

MOQ : 1 pcs/lot

Price : negotiable

Payment Terms : T/T

Supply Ability : 100k pcs/month

Delivery Time : 20 days

Packaging Details : Vacuum bubble bag packaging

Material : FR4 TG>170

No of layers : 8 Layer

PCB Kind : HDI PCB

PCB Thickness : 1.0 MM

Surface technics : Immersion Gold 2U'

Min Lind Space&Width : 3/3 mil

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8 Layer HDI PCB Half Hole Blind And Buried Holes 1.0 MM Thickness

Board Info:

1 Part NO: Half hole PCB0017

2 Layer Count: 8 Layer PCB

3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM

4 Solder Mask: Green

5 Min Lind Space&Width: 3/3 mil

6 Application Area: GPS Module

7 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L3-L6 0.15MM, L6-L7 0.1MM, L7-L8 0.1MM, L1-L2 0.2MM Blind and Buried Holes

Our Capabilities:

NO	Item	Capability
1	Layer Count	1-24 Layers
2	Board Thickness	0.1mm-6.0mm
3	Finished Board Max Size	700mm*800mm
4	Finished Board Thickness Tolerance	+/-10% +/-0.1(<1.0mm)
5	Warp	<0.7%
6	Major CCL Brand	KB/NanYa/ITEQ/ShengYi/Rogers Etc
7	Material Type	FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8	Drill Hole Diameter	0.1mm-6.5mm
9	Out Layer Copper Thickness	1/2OZ-8OZ
10	Inner Layer Copper Thickness	1/3OZ-6OZ
11	Aspect Ratio	10:1
12	PTH Hole Tolerance	+/-3mil
13	NPTH Hole Tolerance	+/-1mil
14	Copper Thickness of PTH Wall	>10mil(25um)
15	Line Width And Space	2/2mil
16	Min Solder Mask Bridge	2.5mil
17	Solder Mask Alignment Tolerance	+/-2mil
18	Dimension Tolerance	+/-4mil
19	Max Gold Thickness	200u'(0.2mil)
20	Thermal Shock	288℃, 10s, 3 times
21	Impedance Control	+/-10%
22	Test Capability	PAD Size min 0.1mm
23	Min BGA	7mil
24	Surface Treatment	OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

S1000-2 Data Sheet:

S1000-2
Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.25	DSC	℃	180
Tg		IPC-TM-650 2.4.24.4	DMA	℃	185
Td		IPC-TM-650 2.4.24.6	5% wt. loss	℃	345
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	45
			After Tg	ppm/℃	220
			50-260℃	%	2.8
T260		IPC-TM-650 2.4.24.1	TMA	min	60
T288		IPC-TM-650 2.4.24.1	TMA	min	20
T300		IPC-TM-650 2.4.24.1	TMA	min	5
Thermal Stress		IPC-TM-650 2.4.13.1	288℃, solder dip	--	100S No Delamination
Volume Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ.cm	2.2 x 108
Volume Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ.cm	4.5 x 106
Surface Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ	7.9 x 107
Surface Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ	1.7 x 106
Arc Resistance		IPC-TM-650 2.5.1	D-48/50+D-4/23	s	100
Dielectric Breakdown		IPC-TM-650 2.5.6	D-48/50+D-4/23	kV	63
Dissipation Constant (Dk)		IPC-TM-650 2.5.5.9	1MHz	--	4.8
Dissipation Constant (Dk)		IEC 61189-2-721	10GHz	--	—
Dissipation Factor (Df)		IPC-TM-650 2.5.5.9	1MHz	--	0.013
Dissipation Factor (Df)		IEC 61189-2-721	10GHz	--	—
Peel Strength (1Oz HTE copper foil)		IPC-TM-650 2.4.8	A	N/mm	—
			After thermal Stress 288℃,10s	N/mm	1.38
			125℃	N/mm	1.07
Flexural Strength	LW	IPC-TM-650 2.4.4	A	MPa	562
Flexural Strength	CW	IPC-TM-650 2.4.4	A	MPa	518
Water Absorption		IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.1
CTI		IEC60112	A	Rating	PLC 3
Flammability		UL94	C-48/23/50	Rating	V-0
Flammability		UL94	E-24/125	Rating	V-0

Product Tags:

HDI Half Hole PCB

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